HEAT INSULATING PANEL, HEAT-INSULATING AIRTIGHT STRUCTURE, AND METHOD FOR CONSTRUCTING THE HEAT INSULATING PANEL

• Main Author: SAWAMURA RYOICHI
• Format: Patent
• Language: English
• Published: 17.03.2011
• Subjects: BUILDING; CEILINGS; FIXED CONSTRUCTIONS; FLOORS; GENERAL BUILDING CONSTRUCTIONS; INSULATION OR OTHER PROTECTION OF BUILDINGS; ROOFS; WALLS, e.g. PARTITIONS

PROBLEM TO BE SOLVED: To provide a heat insulating panel to be arranged with high heat insulating properties and airtightness even in a large structural frame and excellent in constructibility; and also to provide a heat insulating airtight structure, and a construction method. SOLUTION: The heat insulating panel is equipped with: a first panel 11 which is a rectangular heat insulating plate; a second panel 12 which is another rectangular heat insulating plate having one side arranged in such a manner as to butt against the one side of the first panel; a surface airtight tape 13 which is stuck across one surface of the first panel and that of the second panel, on the sides butting against each other; and an end surface airtight tape 14 which is stuck across an end surface of the first panel and that of the second panel, on the sides butting against each other. The heat insulating panel can be deformed into an unfolded attitude in which the first and second panels are juxtaposed, or a folded attitude in which the first and second panels are superposed on each other, and the length of any one of the sides is 1,365 mm or more in the expanded attitude. COPYRIGHT: (C)2011,JPO&INPIT