SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor package capable of suppressing warpage of a lead frame and peeling of a sealing resin without specially preparing an insulator for thermally connecting the package to the outside. SOLUTION: The semiconductor package S1 constituted by mounting a semico...

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Bibliographic Details
Main Authors TEJIMA TAKANORI, NORITAKE CHIKAGE
Format Patent
LanguageEnglish
Published 10.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor package capable of suppressing warpage of a lead frame and peeling of a sealing resin without specially preparing an insulator for thermally connecting the package to the outside. SOLUTION: The semiconductor package S1 constituted by mounting a semiconductor element 20 on one surface 11 of the lead frame 10 and sealing those lead frame 10 and semiconductor element 20 with the sealing resin 30 while exposing the other surface 12 of the lead frame 10 is provided with an insulating film 50 with an electric insulation property having larger adhesion to the sealing resin 30 than the lead frame 10 and made of ceramic at parts of surfaces 11 to 13 of the lead frame 10 coated with the sealing resin 30 so that the parts are coated, the parts being coated with the sealing resin 30 in contact with the sealing resin 30 with the insulating film 50 interposed. The insulating film 50 is provided even on the other surface 12 of the lead frame 10 to coat the other surface 12, and the insulating film 50 coating the other surface 12 is exposed from the sealing resin 30. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090195468