METHOD FOR MANUFACTURING BONDED STRUCTURE USING SILVER NANOPARTICLE AND BONDED STRUCTURE

• Main Authors: KIN JINKA, TAKAHASHI AKIO, MATSUKI KOICHIRO, RI SHIYOUTAKU
• Format: Patent
• Language: English
• Published: 10.03.2011
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CABLES; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; LIME, MAGNESIA; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; REFRACTORIES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SLAG; TREATMENT OF NATURAL STONE; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a manufacturing method for producing a bonded structure by using a bonding material which uses metal nanoparticles and permits bonding even at a low temperature of not more than 250°C without impairing the dispersion stability of the metal nanoparticles and to provide a bonded structure produced by the manufacturing method. SOLUTION: In the method for manufacturing a bonded structure by bonding between objects to be bonded using a bonding material including an organic compound and a silver nanoparticle, it is characterized in that the organic compound is either (x1) an organic compound produced by combining polyethylene glycol with an amino group in polyethylene imine or (x2) an organic compound produced by combining polyethylene glycol and a linear epoxy resin with an amino group in polyethylene imine; and a layer of the bonding material is formed between bonding portions of the objects to be bonded and then the bonding portions are heated at a temperature of 100-250°C to bond them to each other. COPYRIGHT: (C)2011,JPO&INPIT