METHOD OF MANUFACTURING OPTICAL MODULE

• Main Authors: SAEKI TOMOYA, OGUCHI KEITARO, TANAKA KAZUNORI
• Format: Patent
• Language: English
• Published: 03.03.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical module in which an optical device and a sleeve are securely and tightly bonded. SOLUTION: The optical module 11 includes the optical device 13 mounted with an optical semiconductor element and the metallic sleeve 12 holding an optical fiber optically coupled to the optical semiconductor element such that the optical device 13 and metallic sleeve 12 are bonded together with at least two or more kinds of adhesive, and the sleeve 12 has a plurality of slits 12c formed at a part bonded to the optical device. The method of manufacturing the optical module includes a first bonding process of temporarily fixing the optical device and sleeve using an ultraviolet ray setting type adhesive and a second bonding process of principally fixing the optical device and sleeve using a thermosetting type adhesive. In the second bonding process, an adhesive containing two or more curing agents in a composition is used as the thermosetting type adhesive and thermally cured at a temperature which is 3 to 10°C higher than the reaction start temperature of the curing agents. COPYRIGHT: (C)2011,JPO&INPIT