COMPOSITION FOR CONDUCTIVE FILM FORMATION AND CONDUCTIVE FILM FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a composition for conductive film formation capable of forming a practical conductive film with conductivity and a conductive film forming method using the same, without using metal fine particles, in forming a conductive film with copper as a main component. SOLUTIO...

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Bibliographic Details
Main Author YANASE MANABU
Format Patent
LanguageEnglish
Published 17.02.2011
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:PROBLEM TO BE SOLVED: To provide a composition for conductive film formation capable of forming a practical conductive film with conductivity and a conductive film forming method using the same, without using metal fine particles, in forming a conductive film with copper as a main component. SOLUTION: A conductive film forming composition containing noble metal compounds, copper salt, coordinating compounds, and a reductant is coated on a base material, and then is heated under a non-oxidizing atmosphere to form a conductive film on the base material. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090178753