LEAD FRAME DESIGN FOR IMPROVING RELIABILITY

PROBLEM TO BE SOLVED: To provide an electronic device package having reliability-improved metal-plated leads by preventing a metal plate from being newly exposed when the lead is separated, so as to alleviate metal whisker formation.SOLUTION: An electronic device package 100 is provided with a lead...

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Bibliographic Details
Main Authors OSENBACH JOHN W, GOLICK LARRY W, STAHLEY MATTHEW E, LOW QWAI HOONG
Format Patent
LanguageEnglish
Published 06.01.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electronic device package having reliability-improved metal-plated leads by preventing a metal plate from being newly exposed when the lead is separated, so as to alleviate metal whisker formation.SOLUTION: An electronic device package 100 is provided with a lead frame 105 having at least one lead 110 having a notch 205. The notch includes at least one reentrant angle larger than 180 degrees and is located remotely to the cut end of the lead.
Bibliography:Application Number: JP20100137977