SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board wherein short-circuit between connection electrodes for electric connection to a semiconductor chip can be prevented, and to provide a semiconductor device using the same. SOLUTION: A wiring board 15 includes: connection electrodes 14 for connection to...

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Bibliographic Details
Main Authors TANIDA KAZUMA, MIYATA OSAMU
Format Patent
LanguageEnglish
Published 16.12.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board wherein short-circuit between connection electrodes for electric connection to a semiconductor chip can be prevented, and to provide a semiconductor device using the same. SOLUTION: A wiring board 15 includes: connection electrodes 14 for connection to a semiconductor chip 3, which are formed on a junction surface 15a to which the semiconductor chip 3 is joined; a solder resist film 6 which is formed on the junction surface 15a and has opening spaces 6a for exposing the connection electrodes 14; and a low-melting point metal film 16 which is provided on the connection electrodes 14 within the opening spaces 6a and is made of a low-melting point metal material having a lower solidus temperature than the connection electrodes 14. Each opening 6a is formed so that its volume VOis larger than the sum of a volume VPof the connection electrode 14 disposed in the opening space 6a and a volume VLof the low-melting point metal film 16. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100215667