METHOD OF MANUFACTURING LEAD FRAME, LEAD FRAME, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To form a 3D structure without performing bending work or attachment of a connecting auxiliary member, and to suppress wear of a blade in segmenting a semiconductor device into pieces. SOLUTION: This method of manufacturing a lead frame includes processes of: fixing, on a princ...

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Bibliographic Details
Main Authors TAKAHASHI GOSUKE, AIDA MASATO, MIKI KAZUYUKI
Format Patent
LanguageEnglish
Published 09.12.2010
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To form a 3D structure without performing bending work or attachment of a connecting auxiliary member, and to suppress wear of a blade in segmenting a semiconductor device into pieces. SOLUTION: This method of manufacturing a lead frame includes processes of: fixing, on a principal surface of an insulating base material, first metal pieces formed by stamping a first metal plate while intersecting the first metal plate with the insulating base material; and fixing, on the principal surface of the insulating base material, second metal pieces formed by stamping a second metal plate having a thickness different from that of the first metal plate while intersecting the second metal plate with the insulating base material. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090129679