THIN SLICE PREPARATION DEVICE

• Main Authors: KIJIMA YUKIMITSU, NONOYAMA MASATOSHI, ITO TETSUO
• Format: Patent
• Language: English
• Published: 25.11.2010
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To provide a miniaturizable thin slice preparation device capable of suppressing a depth dimension of the device. SOLUTION: This thin slice preparation device 1 includes a cutting blade 6 for slicing an embedding block B for embedding a biosample, a moving mechanism 5 for slicing the upper surface of the embedding block B with the cutting blade 6 by moving the embedding block B toward the blade side of the cutting blade 6, and a conveyance mechanism 9 for conveying a thin slice X scraped out from the embedding block B. In the device 1, the blade of the cutting blade 6 is extended vertically to the front face 1a of the device, and the embedding block B is moved obliquely to the front face 1a of the device by the moving mechanism 5, and the thin slice X is conveyed along the front face 1a of the device by the conveyance mechanism 9. COPYRIGHT: (C)2011,JPO&INPIT