MULTILAYER PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of reducing internal wiring length, and excelling in connection reliability, and a method of manufacturing the same. SOLUTION: Through-holes 36 are formed to penetrate a core substrate 30 and lower layer inter-layer resin ins...

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Bibliographic Details
Main Authors SATAKE HIROAKI, KAWASAKI YOGO, IWATA YUTAKA
Format Patent
LanguageEnglish
Published 18.11.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of reducing internal wiring length, and excelling in connection reliability, and a method of manufacturing the same. SOLUTION: Through-holes 36 are formed to penetrate a core substrate 30 and lower layer inter-layer resin insulation layers 50, and via holes 66 are formed directly above the through-holes 36. Thereby, the through-holes 36 and the via holes 66 are formed into linear shapes to reduce wiring length, and the transmission speed of a signal can be increased. Since the through-holes 36 are directly connected to the via holes 66 connected to solder bumps 76 (conductive connection pins 78), this multilayer printed wiring board excels in connection reliability. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100186429