DICING TAPE WITH DIE ATTACH FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
PROBLEM TO BE SOLVED: To provide a dicing tape with a die attach film capable of smoothly picking up a semiconductor chip with high success rate without damaging the semiconductor chip even when it is extremely thin such as a thickness of 50 μm or less, not degrading the mounting efficiency in die a...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
18.11.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a dicing tape with a die attach film capable of smoothly picking up a semiconductor chip with high success rate without damaging the semiconductor chip even when it is extremely thin such as a thickness of 50 μm or less, not degrading the mounting efficiency in die attach, and manufacturing a semiconductor apparatus with high productivity. SOLUTION: A dicing tape with a die attach film is used for dicing of a semiconductor wafer, and includes a layer structure of a dicing tape/a supporting tape/a die attach film. The supporting tape includes a self-rolling peelability. COPYRIGHT: (C)2011,JPO&INPIT |
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Bibliography: | Application Number: JP20090112002 |