MACHINING METHOD OF THIN WAFER

• Main Author: TANIZAKI HIROSHI
• Format: Patent
• Language: English
• Published: 18.11.2010
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To obtain an excellent cutting surface with a high yield by stopping the vibration of a large number of thin wafers at a cutting start side during the cutting of a work while preventing the generation of a crack by the vibration of the wafers and a saw mark. SOLUTION: In a method of cutting the work 3 by a wire 2 of a wire saw 1 into the large number of thin wafers 5, the work 3 is fixed to the cutting finish side, an incision plate 9 is adhered to a cutting start surface of the work 3 before cutting of the work 3 starts, cutting by the wire 2 is started with the incision plate 9 being a cutting start position, the cutting of the incision plate 9 is stopped once during the cutting of the incision plate 9, the surface of the incision plate 9 at the cutting start position is washed, a fixing plate 11 is thereafter adhered to the surface of the incision plate 9 at the cutting start position, and thereby the large number of thin wafers 5 are fixed to the cutting start side also. COPYRIGHT: (C)2011,JPO&INPIT