PRINTED CIRCUIT BOARD RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THIS

• Main Authors: LIM SUNG TAEK, LEE HWA YOUNG, OH JUN ROK, CHO JAE CHOON, PARK MOON SOO
• Format: Patent
• Language: English
• Published: 11.11.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a printed circuit board resin composition excellent in thermal safety, mechanical strength and reliability, superior to an existing composition in moisture absorption-resistance, having no failure in a fixed humidity and excellent in peeling off strength, and a printed circuit board using this. SOLUTION: The resin composition includes a composite epoxy resin containing 41-80 wt.% of a naphthalene deformation epoxy resin having an average epoxy resin equivalent of 100-200 and 20-59 wt.% of a phosphoric epoxy resin having an average epoxy resin equivalent of 400-800, 0.3-1.5 equivalent of a bisphenol A type curing agent relative to a total mixing equivalent of an epoxy group of the composite epoxy resin, 0.1-1 pts.wt. of a curing accelerator relative to 100 pts.wt. of the composite epoxy resin, and 10-40 pts.wt. of an inorganic filler relative to 100 pts.wt. of the composite epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT