CONDUCTIVE TRANSCRIPTION FILM, AND FORMING METHOD OF CONDUCTIVE PATTERN USING IT

PROBLEM TO BE SOLVED: To provide a conductive transcription film which can be formed at low temperatures, and of which the conductivity can be obtained easily and inexpensively by the simple and convenient transcription of the film, and to provide a forming method of a conductive pattern using the c...

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Bibliographic Details
Main Authors TSURUOKA YASUO, IWAMURO MITSUNORI, YOSHIDA TAKESHI
Format Patent
LanguageEnglish
Published 04.11.2010
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Summary:PROBLEM TO BE SOLVED: To provide a conductive transcription film which can be formed at low temperatures, and of which the conductivity can be obtained easily and inexpensively by the simple and convenient transcription of the film, and to provide a forming method of a conductive pattern using the conductive transcription film. SOLUTION: The conductive transcription film is formed by sequentially laminating a conductive layer and a negative photosensitive resin layer on a temporary support body. The conductive transcription film is formed by sequentially laminating a positive photosensitive resin layer, the conductive layer, and the negative photosensitive resin layer on the temporary support body. The conductive layer is preferably a conductive film containing one of an indium oxide, a zinc oxide, a tin oxide, gold, silver, copper, and aluminum as a main component. The forming method of the conductive pattern includes a process in which the negative photosensitive resin layer side is stuck to the support body using the conductive transcription film, and a process to expose a prescribed part. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090100857