METHOD OF BONDING ELECTRONIC COMPONENT WITH BUMP

PROBLEM TO BE SOLVED: To provide a method of bonding an electronic component with a bump in which proper bonding conditions are easily set. SOLUTION: After a bonding head is lowered to bring the bump 30a into contact with an electrode 32b, the bonding head is further lowered to decrease the height o...

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Bibliographic Details
Main Authors KOSHIO TEPPEI, ISHIKAWA TAKATOSHI, KINKI KOZO
Format Patent
LanguageEnglish
Published 28.10.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of bonding an electronic component with a bump in which proper bonding conditions are easily set. SOLUTION: After a bonding head is lowered to bring the bump 30a into contact with an electrode 32b, the bonding head is further lowered to decrease the height of the bump 30a, and then the bonding head is applied with ultrasonic vibrations. Thereafter, a height measuring means monitors the gap between the electronic component 30 and a surface 30a to be pressed against and after the gap reaches a target value, the application of the ultrasonic vibrations is carried on in the state wherein the gap is maintained and stopped at a predetermined time later. Consequently, a load value of pressing of the bonding head is excluded from bonding conditions, and even when various element conditions such as a combination of an object substrate 32 and the bump 30a are different, proper bonding conditions are easily set. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090092615