METHOD OF MANUFACTURING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device for improving reliability of wiring laminated on a slope, wherein a step part is formed of an electronic component arranged on a mounting surface of a mounting substrate and the mounting surface, an insulating slope is f...

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Bibliographic Details
Main Author UEHARA NOBORU
Format Patent
LanguageEnglish
Published 28.10.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device for improving reliability of wiring laminated on a slope, wherein a step part is formed of an electronic component arranged on a mounting surface of a mounting substrate and the mounting surface, an insulating slope is formed on the step part, and the electronic device is formed by laminating a wiring for connecting the mounting substrate and electronic component on the slope. SOLUTION: A bulk 25 of the slope 17 is formed of slope elements 26 which are formed by curing droplets D1 at every discharge. In addition, droplets D2 formed of insulating ink with lower viscosity than the droplets D1 are discharged on a surface of the bulk 25. The droplets D2 with lower viscosity are easily wetted and spread after landing, and flow between projections on the surface of the bulk 25. The slope 17 is formed of a cured object 35, which is formed by curing the droplets D2 in the above state, and the bulk 25. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090092325