MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE

• Main Authors: SASAKI YOSHITAKA, SHIMIZU TATSUJI
• Format: Patent
• Language: English
• Published: 14.10.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To mass produce an electronic component package with a low cost in a short period of time. SOLUTION: A manufacturing method for an electronic component package forms at first a wafer 1 which includes: a plurality of sets of an external connection terminals 11 corresponding to a plurality of electronic component packages; a holding part 15 for holding the plurality of sets of the external connection terminals 11; and a plurality of a substrate scheduled parts 2 that form a substrate of the electronic component package and respectively later by being mutually separated. Then, at least one electronic component chip 3 is joined to each substrate scheduled part 2 in the wafer 1; an electrode of the electronic component chip 3 and the external connection terminal 11 are connected; the electronic component chip 3 are sealed; and the wafer 1 is cut such that the respective substrate scheduled parts 2 are separated from each other to form a plurality of the substrates. The plurality of the external connection terminals are exposed on the side surfaces of the substrate. COPYRIGHT: (C)2011,JPO&INPIT