FRETTING AND WHISKER RESISTANT COATING SYSTEM AND METHOD

PROBLEM TO BE SOLVED: To develop a coated structure which can maintain low contact resistance and good soldering property even after fretting and thermal exposing, and which is combined with lower friction coefficient and one or all additional characteristics of decreased whisker growth. SOLUTION: T...

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Bibliographic Details
Main Authors CHEN SZUCHAIN F, GERFEN JOHN E, KHAN ABID A, ROBINSON PETER W, LASIUK NICOLE A
Format Patent
LanguageEnglish
Published 14.10.2010
Subjects
APPARATUS THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CURRENT COLLECTORS
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To develop a coated structure which can maintain low contact resistance and good soldering property even after fretting and thermal exposing, and which is combined with lower friction coefficient and one or all additional characteristics of decreased whisker growth. SOLUTION: The present invention provides a coated electrically conductive substrate having particular utility where there are multiple closely spaced features and tin whiskers constitute a potential short circuit. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100143456