SUB-RACK STRUCTURE AND RACK STRUCTURE

PROBLEM TO BE SOLVED: To provide a sub-rack structure which is mounted inside a rack mounted with a printed circuit board to improve the heat dissipation properties of the printed circuit board. SOLUTION: The sub-rack structure includes a fan portion 1 which is disposed in its bottom portion with a...

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Bibliographic Details
Main Authors OSATO MASATAKA, ETO MITSURU, KANAMARU YASUHISA, YOSHIZUMI TAKAHISA, KANO KOJI
Format Patent
LanguageEnglish
Published 14.10.2010
Subjects
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