SUB-RACK STRUCTURE AND RACK STRUCTURE

• Main Authors: OSATO MASATAKA, ETO MITSURU, KANAMARU YASUHISA, YOSHIZUMI TAKAHISA, KANO KOJI
• Format: Patent
• Language: English
• Published: 14.10.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a sub-rack structure which is mounted inside a rack mounted with a printed circuit board to improve the heat dissipation properties of the printed circuit board. SOLUTION: The sub-rack structure includes a fan portion 1 which is disposed in its bottom portion with a fan body for cooling air to generate an upward air flow by the rotation of the fan for cooling air, a PIU-mounted portion 2 which is disposed above the fan portion 1 and is mounted with the printed circuit board and operation portion 3 which is disposed above the PIU-mounted portion 2 to receive an operation requested from the outside to the printed circuit board and is detachably mounted with one or more convection guide plate unit bodies, the convection guide plate unit bodies being interiorly divided into two spaces consisting of an upper one and a lower one by a partition plate and having the openings in the respective spaces on the front surface side and the bottom surface side. COPYRIGHT: (C)2011,JPO&INPIT