OPERATION PROCESSING DEVICE OR ACF STICKING STATE INSPECTION METHOD, AND DISPLAY SUBSTRATE MODULE ASSEMBLING LINE OR DISPLAY SUBSTRATE MODULE ASSEMBLING METHOD

PROBLEM TO BE SOLVED: To provide a processing operation device or an ACF sticking state inspection method, capable of reducing the total operation time of ACF sticking operation and inspection operation of ACF sticking state or capable of reducing the processing operation device width required for A...

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Bibliographic Details
Main Authors AKIBA YUJI, TAKEDA MASAOMI, KATAHO HIDEAKI, HISA TAKAFUMI, EBISAWA KEIICHI, TAMAMOTO JUNICHI, SAITO YOSHIHIRO, DOI HIDEAKI
Format Patent
LanguageEnglish
Published 14.10.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a processing operation device or an ACF sticking state inspection method, capable of reducing the total operation time of ACF sticking operation and inspection operation of ACF sticking state or capable of reducing the processing operation device width required for ACF sticking, and a display substrate module assembling line and a display substrate module assembling method, capable of reducing the tact time of display substrate module assembling, or reducing the line length. SOLUTION: When an ACF stuck to a predetermined position of a side of a display substrate is illuminated and imaged, and the sticking state of the ACF is inspected based on the imaging result, at least the imaging and inspection of the display substrate are performed during conveyance after sticking the ACF. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090076242