INKJET INK AND CURED FILM OBTAINED FROM THE INK

PROBLEM TO BE SOLVED: To provide inkjet ink, which has high adhesion with metal, can form a cured film on an electronic circuit board so as to be able to prevent swelling or peeling in the boundary of the electronic circuit board when heated, can save the time and effort required for the formation o...

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Bibliographic Details
Main Authors DEYAMA YOSHIHIRO, MOROKOSHI SHINTA, ITAMI SETSUO
Format Patent
LanguageEnglish
Published 14.10.2010
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COLOUR PRINTING
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
LINING MACHINES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
STAMPS
TRANSPORTING
TYPEWRITERS
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To provide inkjet ink, which has high adhesion with metal, can form a cured film on an electronic circuit board so as to be able to prevent swelling or peeling in the boundary of the electronic circuit board when heated, can save the time and effort required for the formation of a protective film upon production of an electronic circuit board, and can reduce the number of consumable supplies. SOLUTION: The inkjet ink contains a compound (A) having a phosphoric ester, a radically polymerizable monomer (B) having a thermally crosslinkable functional group, a photoinitiator (C), and a multifunctional (meth)acrylate (D) other than the radically polymerizable monomer (B). COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090084423