METHOD OF MANUFACTURING WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-density wiring board which secures adhesion strength between resins using a thermoplastic resin having small size variation due to humidity, a low dielectric loss tangent, and a low relative dielectric constant, and is suitable for hi...

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Main Authors GOTO YOSHIHIRO, SHOMURA MITSUNOBU, ITANI TORU, OKABAYASHI NAOYA, YOSHIKAWA ATSUO, TAKARABE SATOSHI, HIRAISHI KATSUFUMI, ONODERA MINORU
Format Patent
LanguageEnglish
Published 30.09.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-density wiring board which secures adhesion strength between resins using a thermoplastic resin having small size variation due to humidity, a low dielectric loss tangent, and a low relative dielectric constant, and is suitable for high-speed transmission. SOLUTION: In a method of manufacturing a stacked wiring board by stacking unit substrates each provided with a conductive layer on at least one surface of a thermoplastic resin layer, at least one surface of each unit substrate is subjected to plasma roughening processing, the surface having been processed is superposed on a surface of another unit substrate to form a stacked plate having two or more layers, and the stacked plate is subjected to heating and pressure processing. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20100127928