LIQUID EJECTION HEAD AND IMAGE FORMING APPARATUS

• Main Authors: SHIMAZOE MASAKI, KOBAYASHI HIROSHI
• Format: Patent
• Language: English
• Published: 30.09.2010
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To solve the problem that solder joint strength decreases or a tact time decreases when laser joining is carried out using a large head even if the width of a common wiring electrode of a flexible substrate is equivalent to the width of an individual wiring electrode. SOLUTION: A non-drive piezoelectric element column 12Ba wider than a drive piezoelectric element column 12A is formed at one end of a piezoelectric element member 12, and a common electrode portion 25 connected with the common electrodes 24 of all the drive piezoelectric element columns 12A is provided on the end face of the non-fr piezoelectric element column 12Ba at the individual electrode side. The individual wiring electrodes 31A of an FPC 15 are joined with an electrical connection member, i.e. solder 32, to the individual electrodes 23 of the drive piezoelectric element columns 12A of the piezoelectric element member 12, and electrically connecting the electrodes. Furthermore, the common wiring electrode 31B of the FPC 15 is similarly joined with the solder 32 to the common electrode portion 25 provided in the non-drive piezoelectric element column 12Ba at one end side of the piezoelectric element member 12, and electrically connecting the electrodes. COPYRIGHT: (C)2010,JPO&INPIT