METHOD OF DICING ELEMENT

PROBLEM TO BE SOLVED: To provide a method of dicing an element which dices the element without allowing chips of a surface protective tape adhesive to stick to a side face of an element piece. SOLUTION: According to the method of dicing the element, the surface protective tape having an adhesive lay...

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Bibliographic Details
Main Authors NISHIO AKINORI, TAKAHASHI TOMOKAZU
Format Patent
LanguageEnglish
Published 24.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of dicing an element which dices the element without allowing chips of a surface protective tape adhesive to stick to a side face of an element piece. SOLUTION: According to the method of dicing the element, the surface protective tape having an adhesive layer that cures upon exposure to active energy rays or heat is pasted on the surface of the element and is subjected to active energy rays or heat to cure. In this state, the element is diced from the side of the surface protective tape into element pieces, using a cutting means. A rotating blade containing cutting abrasive grains can be used as the cutting means. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090054260