LIQUID RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a semiconductor package which is excellent in mechanical properties and has high reliability by reducing cracks of the semiconductor package sealed by using the liquid resin composition for sealing, alleviating stress concentration in the liquid resin composition for...

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Bibliographic Details
Main Author MITSUTA MASAYA
Format Patent
LanguageEnglish
Published 16.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor package which is excellent in mechanical properties and has high reliability by reducing cracks of the semiconductor package sealed by using the liquid resin composition for sealing, alleviating stress concentration in the liquid resin composition for sealing, and suppressing deformation of the semiconductor package. SOLUTION: The liquid sealing resin composition for sealing includes (A) an epoxy resin, (B) an amine curing agent, and (C) a low-stress agent. In the liquid resin composition for sealing, the low-stress agent (C) is an amine-modified polyalkylene glycol (C1). COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090046590