HEAT-STABILIZED COPOLYAMIDE

PROBLEM TO BE SOLVED: To provide a copolyamide being excellent in heat stability at a high temperature, heat discoloration-resistance and moldability. SOLUTION: The copolyamide comprises (a) a unit comprising (a-1) 1,4-cyclohexanedicarboxylic acid and (a-2) a 6-8C aliphatic diamine, (b) a unit compr...

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Bibliographic Details
Main Authors SAKUMA TERUAKI, KANO YASUKAZU, ARAMAKI MASAAKI
Format Patent
LanguageEnglish
Published 09.09.2010
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a copolyamide being excellent in heat stability at a high temperature, heat discoloration-resistance and moldability. SOLUTION: The copolyamide comprises (a) a unit comprising (a-1) 1,4-cyclohexanedicarboxylic acid and (a-2) a 6-8C aliphatic diamine, (b) a unit comprising (b-1) an aliphatic dicarboxylic acid and/or an alicyclic dicarboxylic acid other than 1,4-cyclohexanedicarboxylic acid and (b-2) a 6-8C aliphatic diamine, and (c) a unit comprising a lactam and/or an aminocarboxylic acid. In the copolyamide, the (a) is 13.0-40.0 mol%, the (b) is 50.0-86.9 mol%, and the (c) is 0.1-10.0 mol%. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090042192