CURABLE COMPOSITION
PROBLEM TO BE SOLVED: To provide a curable composition excellent in both of storage shape holding properties of a thermally molded product and scratch resistance of a molded product formed by completely curing the thermoformed product. SOLUTION: The curable composition includes a polyepoxide (A), an...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
09.09.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a curable composition excellent in both of storage shape holding properties of a thermally molded product and scratch resistance of a molded product formed by completely curing the thermoformed product. SOLUTION: The curable composition includes a polyepoxide (A), an ester (B) of a compound having one phenolic hydroxy group and a polyvalent carboxylic acid, a thermal polymerization catalyst (C), a (meth)acrylate (D), a photoradical polymerization initiator (E), a vinyl polymer (F) having a weight-average molecular weight of 500,000 to 1,000,000 and silica fine particles (G) having 10 to 100 nm volume-average particle diameter. The content of the ester (B) is preferably such an amount that the number of moles of ester bonds is 0.05 to 1.0 mole to 1 mole of an epoxy group of the polyepoxide (A). COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20090041555 |