ELECTRONIC COMPONENT, LEAD WIRE, AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide an electronic component for which mechanical connection strength between an extraction electrode and a metal wire is secured, drop of a whisker to a board is prevented, and impact resistance, vibration resistance and short-circuiting resistance are improved. SOLUTION...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
02.09.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide an electronic component for which mechanical connection strength between an extraction electrode and a metal wire is secured, drop of a whisker to a board is prevented, and impact resistance, vibration resistance and short-circuiting resistance are improved. SOLUTION: The electronic component comprises a capacitive element 16, and lead wires 11 connected to the capacitive element 16, and is structured such that the lead wire 11 comprises a metallic extraction electrode 12 connected to one end of the capacitive element 16, a metal wire 13 harder than a material of the extraction electrode 12, and having one end 13a embedded in the other end 12b of the extraction electrode 12, and a flange part 15 formed between the one end 13a and the other end 13b of the metal wire 13; interfaces of the extraction electrode 12 and the embedded metal wire 13 are welded to each other to form an alloy layer 14; and the flange part 15 is arranged to cover an exposed part 14a where the alloy layer 14 is exposed from the other end 12b of the extraction electrode 12. COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20090036199 |