SYSTEM AND METHOD FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method and a system for treating a substrate. SOLUTION: The system for treating a substrate includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatme...

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Bibliographic Details
Main Authors HWANG SOOMIN, CHOI JINYOUNG, GO JAE SEUNG, KIMU DONHO
Format Patent
LanguageEnglish
Published 12.08.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method and a system for treating a substrate. SOLUTION: The system for treating a substrate includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a step for coating a protective layer on the wafer before an exposure step. The second module performs a step for cleaning the wafer and a post-exposure bake step after the exposure step. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20100019559