METHOD FOR DEPOSITING THIN FILM

• Main Authors: SAKURAI TAKESHI, AMANO NAOJI, CHIBA KOKI, KYO YUSHO, SONG YIZHOU
• Format: Patent
• Language: English
• Published: 12.08.2010
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a method for depositing a thin film capable of performing film-deposition by highly efficiently generating stable plasma. SOLUTION: In the method for depositing the thin film, a thin film depositing device including a vacuum vessel 11 maintaining the inner part thereof in a vacuum and a plasma generating means generating plasma in an antenna housing room 80A connected to the vacuum vessel is used. The method for manufacturing the thin film includes: a pressure reducing step for evacuating the inner part of the vacuum vessel in a vacuum state and reducing pressure of the inner part of the antenna housing room in a vacuum state of 10-3Pa or lower to be lower than that of the vacuum vessel; and a plasma treatment step for generating plasma in the inner part of the vacuum vessel by applying a high frequency voltage to an antenna 85a and subjecting the thin film formed in the vacuum vessel to plasma treatment. COPYRIGHT: (C)2010,JPO&INPIT