METHOD OF OBTAINING ELECTRONIC CIRCUITRY FEATURE

PROBLEM TO BE SOLVED: To provide a method for obtaining electronic circuitry features. SOLUTION: The present disclosure relates to a method for obtaining fine circuitry features by positioning a circuit board precursor, wherein the circuit board precursor having a cover layer and an insulating subst...

Full description

Saved in:
Bibliographic Details
Main Authors FANG SHANE, LEE YUEH-LING, OLIVER GLENN
Format Patent
LanguageEnglish
Published 29.07.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a method for obtaining electronic circuitry features. SOLUTION: The present disclosure relates to a method for obtaining fine circuitry features by positioning a circuit board precursor, wherein the circuit board precursor having a cover layer and an insulating substrate is arranged in proximity to a laser radiation source. Laser ablation is selectively applied to the underlying insulating substrate through the cover layer, and then the cover layer is treated with water, a dilute alkaline solution, or a dilute acid solution to remove the cover layer and to reveal one or more circuitry features on the insulating substrate, which are smaller than the ones obtained when the cover layer is not used. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20100007978