ETCHING SOLUTION COMPOSITION

• Main Authors: KIMURA MAYUMI, TAKO TSUGUHIRO, AOYAMA TETSUO, MATSUDA TOMOTAKE
• Format: Patent
• Language: English
• Published: 29.07.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain a metal film having a desirable shape with an intended low taper angle and excellent flatness, by etching a metal film, such as aluminum film, aluminum alloy film, with excellent controllability while controlling or preventing occurrence of resist bleeding. SOLUTION: Water solution containing phosphoric acid, nitric acid, an organic acid salt, and surfactant is used as an etching solution composition for etching the metal film on a substrate. As to the organic acid salt, at least one selected from the group consisting of an ammonium salt, amine salt, quarternary ammonium salt, and alkali metal salt of at least one selected from the group consisting of aliphatic monocarboxylic acid, aliphatic polycarboxylic acid, aliphatic oxycarboxylic acid, aromatic monocarboxylic acid, aromatic polycarboxylic acid, and aromatic oxycarboxylic acid is used. The etching solution composition is used when the metal film is made from aluminum or an aluminum alloy. COPYRIGHT: (C)2010,JPO&INPIT