ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide an alignment device, capable of accurately positioning a wafer by accurately measuring the position of the periphery of a wafer which is thinned to the extent that the periphery of the wafer is bent and deformed due to dead weight. SOLUTION: The alignment device incl...

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Bibliographic Details
Main Authors IKEDA SATOSHI, YAMAMOTO MASAYUKI, NONOMURA KENJI
Format Patent
LanguageEnglish
Published 22.07.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an alignment device, capable of accurately positioning a wafer by accurately measuring the position of the periphery of a wafer which is thinned to the extent that the periphery of the wafer is bent and deformed due to dead weight. SOLUTION: The alignment device includes a holding stage 1 in a size of not less than the external form of a semiconductor wafer W; and a photosensor 2 for optically detecting a peripheral position of the semiconductor wafer W placed on the holding stage 1 for sucking and holding. The holding stage 1 is formed by, for example, vertically passing through a slit 10 facing the outer-periphery section of the semiconductor wafer W placed on the periphery. The transmission-type photosensor 2 includes a projector 2a and a light-receiving unit 2b, that are provided opposed, while they sandwich the slit 10 from above and below. The photosensor measures the periphery of the wafer W exposed from the holding stage 1 at the portion of the slit 10. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090002311