METHOD FOR ENCAPSULATING SUBSTRATE AND METHOD FOR FABRICATING LIGHT EMITTING DIODE DEVICE

PROBLEM TO BE SOLVED: To provide a sealing method of a substrate and a fabrication method of a light-emitting diode device. ŽSOLUTION: The present invention relates to a sealing method of a substrate which includes: (a1) providing a substrate with a plurality of chips mounted on a top side of the su...

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Bibliographic Details
Main Author TSAI COLIN BIN-HONG
Format Patent
LanguageEnglish
Published 01.07.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a sealing method of a substrate and a fabrication method of a light-emitting diode device. ŽSOLUTION: The present invention relates to a sealing method of a substrate which includes: (a1) providing a substrate with a plurality of chips mounted on a top side of the substrate; (b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer; (c1) exposing the photoresist layer to a light source through a mask, to form unexposed photoresist regions and exposed photoresist regions; (d1) developing the photoresist layer, to uncover underlying portions of the unexposed photoresist regions; (e1) molding the top side of the substrate with a molding material; (f1) curing the molding material; and (g1) removing the exposed photoresist regions from the substrate with a photoresist-removing agent. ŽCOPYRIGHT: (C)2010,JPO&INPIT Ž
Bibliography:Application Number: JP20090135007