HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To reduce the thickness and size of an electronic apparatus while preventing a case of the electronic apparatus from locally having a high temperature. SOLUTION: The heat dissipation device for an electronic apparatus has: the magnesium case 11 (case made of a heat conductive m...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
24.06.2010
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Subjects | |
Online Access | Get full text |
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