HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To reduce the thickness and size of an electronic apparatus while preventing a case of the electronic apparatus from locally having a high temperature. SOLUTION: The heat dissipation device for an electronic apparatus has: the magnesium case 11 (case made of a heat conductive m...

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Bibliographic Details
Main Authors HAGINO NORIYUKI, FUJIBAYASHI HIROKO, FUJIWARA HIROTAKE, MEGURO HIROYUKI
Format Patent
LanguageEnglish
Published 24.06.2010
Subjects
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