HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To reduce the thickness and size of an electronic apparatus while preventing a case of the electronic apparatus from locally having a high temperature. SOLUTION: The heat dissipation device for an electronic apparatus has: the magnesium case 11 (case made of a heat conductive m...

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Bibliographic Details
Main Authors HAGINO NORIYUKI, FUJIBAYASHI HIROKO, FUJIWARA HIROTAKE, MEGURO HIROYUKI
Format Patent
LanguageEnglish
Published 24.06.2010
Subjects
ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
PHOTOGRAPHY
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To reduce the thickness and size of an electronic apparatus while preventing a case of the electronic apparatus from locally having a high temperature. SOLUTION: The heat dissipation device for an electronic apparatus has: the magnesium case 11 (case made of a heat conductive material) capable of dissipating heat in the case; an aluminum sheet metal 32 (heat receiving member) capable of receiving heat from a lamp unit 41 and transferring the received heat; a melamine foam 31 (heat insulating member) configured to prevent transmission of the heat received by the aluminum sheet metal 32; and graphite sheet 21 (heat diffusing member) receiving heat from the melamine foam 31 and diffusing the received heat into the magnesium case 11. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080314444