SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a flip chip semiconductor device preventing destruction of the semiconductor device by implementing the flip chip. SOLUTION: A semiconductor device 10 is provided with: a semiconductor element 11; and a bump electrode 12 formed on one face thereof. A hole 17 just bel...

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Bibliographic Details
Main Author MURAKAMI ASAO
Format Patent
LanguageEnglish
Published 17.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a flip chip semiconductor device preventing destruction of the semiconductor device by implementing the flip chip. SOLUTION: A semiconductor device 10 is provided with: a semiconductor element 11; and a bump electrode 12 formed on one face thereof. A hole 17 just below the bump electrode 12 in the semiconductor element 11 is filled with a resin 13 the elastic modulus of which is smaller than the material constituting the semiconductor element 11. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090156858