WAFER POSITIONING DEVICE

PROBLEM TO BE SOLVED: To provide a wafer positioning device capable of appropriately positioning a wafer, which is thin and large, without causing any trouble when the wafer is carried in or out by a transfer robot. SOLUTION: An aligner device 10 includes a first Bernoulli chuck 12, a second Bernoul...

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Bibliographic Details
Main Authors TSUKIMOTO HIROAKI, TOKUNAGA HIDEYUKI
Format Patent
LanguageEnglish
Published 17.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wafer positioning device capable of appropriately positioning a wafer, which is thin and large, without causing any trouble when the wafer is carried in or out by a transfer robot. SOLUTION: An aligner device 10 includes a first Bernoulli chuck 12, a second Bernoulli chuck 14, a lifting mechanism 62, and a rotating mechanism 64. The first Bernoulli chuck 12 is in a disk-like shape. The Bernoulli chuck 14 is in an annular plate shape having a hollow portion in which the first Bernoulli chuck 12 is stored. The lifting mechanism 62 is configured to lift up and down the Bernoulli chuck from and to the second Bernoulli chuck 14. The rotating mechanism 64 is configured to rotate the first Bernoulli chuck 12 and second Bernoulli chuck 14 in the same direction at the same speed. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080307731