WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: OSUMI KOICHI, YAMADA HIROICHI
• Format: Patent
• Language: English
• Published: 17.06.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring substrate on which a semiconductor element and an electronic component can be excellently mounted. SOLUTION: The wiring substrate includes: a semiconductor element connection pad 2A which is disposed on a mounting portion 1A of an insulating base substance 1, and in which the electrode of a semiconductor integrated circuit element E1 is connected to the upper surface of the semiconductor element connection pad 2A through a conductive bump B1; an electronic component connection pad 2B which is disposed outside the mounting portion 1A on the upper surface of the insulating base substance 1; a first solder resist layer 3a which exposes an upper surface of the semiconductor element connection pad 2A and an upper surface of the electronic component connection pad 2B; a conductive projection 7 which is bonded onto the electronic component connection pad 2B with a thickness exceeding the upper surface of the semiconductor element connection pad 2A, and in which the electrode of an electronic component E2 is connected to the upper surface of the conductive projection 7 through a solder ball B2; and a second solder resist layer 3b which is bonded onto the first solder resist layer 3a so as to surround the mounting portion 1A, with which the side surface of the conductive projection 7 is filled, and which exposes the entire upper surface of the conductive projection 7. COPYRIGHT: (C)2010,JPO&INPIT