CHARGED PARTICLE BEAM MASKING FOR LASER ABLATION MICROMACHINING

PROBLEM TO BE SOLVED: To provide an improved method for substrate micromachining. SOLUTION: Preferred embodiments of this invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabricat...

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Bibliographic Details
Main Authors LYSAGHT MICHAEL, TOTH MILOS, RANDOLPH STEVEN, STRAW MARCUS, UTLAUT MARK W
Format Patent
LanguageEnglish
Published 10.06.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACHINE TOOLS
MATERIALS THEREFOR
METAL-WORKING NOT OTHERWISE PROVIDED FOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide an improved method for substrate micromachining. SOLUTION: Preferred embodiments of this invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090265773