ELECTRONIC COMPONENT PACKAGE, AND PIEZOELECTRIC VIBRATOR
PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the pack...
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Main Author | |
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Format | Patent |
Language | English |
Published |
10.06.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the package body 5 containing electronic components. A pair of first mounting terminals 6, 7 are formed in one diagonal areas along the side facing the outside bottom face of the package body 5, and a pair of second mounting terminals 8, 9 are formed in the other diagonal areas along the side facing the outside bottom face of the package body 5 in this electronic component package 1. COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20080299146 |