ELECTRONIC COMPONENT PACKAGE, AND PIEZOELECTRIC VIBRATOR

PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the pack...

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Bibliographic Details
Main Author NAGANO YOJI
Format Patent
LanguageEnglish
Published 10.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the package body 5 containing electronic components. A pair of first mounting terminals 6, 7 are formed in one diagonal areas along the side facing the outside bottom face of the package body 5, and a pair of second mounting terminals 8, 9 are formed in the other diagonal areas along the side facing the outside bottom face of the package body 5 in this electronic component package 1. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080299146