CUTTING APPARATUS

PROBLEM TO BE SOLVED: To provide a cutting apparatus in which productivity is improved by reducing time required for setting change. SOLUTION: The cutting apparatus 1 for cutting a workpiece 10 includes: a feeding part 100 for feeding a workpiece 10; a machining part 200 for cutting the workpiece 10...

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Bibliographic Details
Main Authors UCHIYAMA SHIGEYUKI, ANDO SHUJI
Format Patent
LanguageEnglish
Published 10.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a cutting apparatus in which productivity is improved by reducing time required for setting change. SOLUTION: The cutting apparatus 1 for cutting a workpiece 10 includes: a feeding part 100 for feeding a workpiece 10; a machining part 200 for cutting the workpiece 10 with cutting blades 71-74 to divide it into a plurality of individualized workpieces 11; a storing part 300 for storing the plurality of individualized workpieces 11; a loader 40 for transporting the workpiece 10 from the feeding part 100 to the machining part 200; and an unloader 41 for transporting the plurality of individualized workpieces 11 from the machining part 200 to the storing part 300. The feeding part 100, the machining part 200 and the storing part 300 are arranged detachably in a line. The loader 40 is connected to a driving source for workpiece holding operation with a first connecting member, wherein the transporting range R1 of the loader 40 is variable by changing the length of the first connecting member. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080303292