SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving energy efficiency when a substrate is heated. SOLUTION: A MMT (Modified Magnetron Type) device 100 includes: a processing chamber 201 for processing a wafer 200; a susceptor 300 provided in the processing chamber...

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Bibliographic Details
Main Authors ISHIZAKA MITSUNORI, YANAGISAWA AKIHIKO
Format Patent
LanguageEnglish
Published 20.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving energy efficiency when a substrate is heated. SOLUTION: A MMT (Modified Magnetron Type) device 100 includes: a processing chamber 201 for processing a wafer 200; a susceptor 300 provided in the processing chamber 201 and holding the wafer 200; a heater 310 provided in the susceptor 300 and heating the wafer 200; and a spacer 320 disposed forming a space between the susceptor 300 and heater 310. The spacer 320 is made of, for example, quartz. Further, the spacer 320 is suitably made of a material having smaller thermal capacity than the susceptor 300. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080287626