DEVICE AND METHOD FOR INSPECTING LED CHIP
PROBLEM TO BE SOLVED: To provide a device and a method for inspecting an LED chip capable of improving a yield by determining with improved accuracy the existence of a flaw in a light extraction surface of the LED chip. SOLUTION: A first processing means 23 performs a binarizing processing of a firs...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
13.05.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a device and a method for inspecting an LED chip capable of improving a yield by determining with improved accuracy the existence of a flaw in a light extraction surface of the LED chip. SOLUTION: A first processing means 23 performs a binarizing processing of a first pick-up image taken with a light from a coaxial epi-illumination device 10 to extract as a bright pixel region a flaw in the light extraction surface of an LED chip 2. A second processing means 24 performs a binarizing processing of a second pick-up image taken with a light from an oblique light-illumination device 11 to extract as a dark pixel region a flaw in the light extraction surface of the LED chip 2. A determining means 25 compares positions in the light extraction surface of the bright pixel region extracted by the first processing means 23 and the dark pixel region extracted by the second processing means 24 to determine the region to be a defective region where the flaw eliminates irregularity if the positions of both correspond to each other. COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20080277391 |