STACKED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a stacked semiconductor device which can be improved in interlayer connection reliability and can be reduced in manufacturing cost, and to provide its manufacturing method. SOLUTION: The stacked semiconductor device 1 includes a plurality of semiconductor devices 3 a...

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Bibliographic Details
Main Authors INABA KIMIO, SHIBATA AKIJI, HOSONO MASAYUKI
Format Patent
LanguageEnglish
Published 06.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a stacked semiconductor device which can be improved in interlayer connection reliability and can be reduced in manufacturing cost, and to provide its manufacturing method. SOLUTION: The stacked semiconductor device 1 includes a plurality of semiconductor devices 3 and 4 which have circuit boards 6 and 11 for ball grid array whereon semiconductor chips 5 and 10 are to be mounted, and which are joined together into a stacked state by reflow mounting using solder balls 2 for interlayer connection. On both sides of the chip mounting face in both edge parts of the circuit board 6, projections 8 are formed to restrict the inclination of the board. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20100024254