SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of achieving high heat dissipation and high brightness while achieving size reduction. SOLUTION: A semiconductor light emitting device A1 includes one or more semiconductor light emitting elements, a resin package 4 surro...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
30.04.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of achieving high heat dissipation and high brightness while achieving size reduction. SOLUTION: A semiconductor light emitting device A1 includes one or more semiconductor light emitting elements, a resin package 4 surrounding the semiconductor light emitting elements, and a lead which has a die-bonding pad for performing the die bonding of the semiconductor light emitting elements, and in which an exposed surface 12 opposite to the die-bonding pad is exposed from the resin package 4, and the exposed surface 12 is surrounded by the resin package 4. COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20090003288 |