SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of achieving high heat dissipation and high brightness while achieving size reduction. SOLUTION: A semiconductor light emitting device A1 includes one or more semiconductor light emitting elements, a resin package 4 surro...

Full description

Saved in:
Bibliographic Details
Main Authors OKADA YASUSUKE, YASUDA SHINTARO, ITAI JUNICHI, KOBAYAKAWA MASAHIKO, MIREBA KAZUHIRO
Format Patent
LanguageEnglish
Published 30.04.2010
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of achieving high heat dissipation and high brightness while achieving size reduction. SOLUTION: A semiconductor light emitting device A1 includes one or more semiconductor light emitting elements, a resin package 4 surrounding the semiconductor light emitting elements, and a lead which has a die-bonding pad for performing the die bonding of the semiconductor light emitting elements, and in which an exposed surface 12 opposite to the die-bonding pad is exposed from the resin package 4, and the exposed surface 12 is surrounded by the resin package 4. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090003288