RESIN-SEALED ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KIKUCHI MASAAKI, HIRAGAMI KATSUYUKI, ISHIDA MASANORI, NOGAMI EIICHI, SHIOMI YUJI
• Format: Patent
• Language: English
• Published: 22.04.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a resin-sealed electronic component that securely prevents a resin from leaking in an engagement portion between a case-side wall member and a case base or a through-hole into which a terminal for external connection is inserted, and to provide a method of manufacturing the resin-sealed electronic component. SOLUTION: The resin-sealed electronic component includes a resin injection groove portion 9 formed along the engagement portion 7 between the case-side wall member 2 and case base 3, a projection portion 14 arranged having a gap with the terminal 6 for external connection, and a resin reception portion 14a extended to below the terminal 6 for external connection along the through-hole 10, and fine gaps are blocked by making a gap closing resin 8 injected into the resin injection groove portion 9 infiltrate a gap of the engagement portion 7 through capillarity and also making a gap closing resin 8 passed through the gap between the resin reception portion 14a and terminal 6 for external connection infiltrate the gap between the through-hole 10 and terminal 6 through capillarity, thereby preventing the resin from leaking. COPYRIGHT: (C)2010,JPO&INPIT