METHOD FOR MANUFACTURING RESIN-MOLDED COMPONENT, AND MOLD

• Main Author: CHIKUAN KENJI
• Format: Patent
• Language: English
• Published: 15.04.2010
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin-molded component in which a decrease in electric connection reliability is suppressed, and a mold forming the resin-molded component. SOLUTION: The invention is the method for manufacturing the resin-molded component in which part of a wiring member having an electric connection function is exposed from a resin-molded member. The method icludes the arranging process of using, for a contact surface with one side containing a connection with a bonding wire in the wiring member, the mold in which a through-hole passing through from the contact surface up to the outer surface is formed, and of allowing the one side to abut on the contact surface to arrange the wiring member inside the shaping die, and the forming process of forming a resin-molded member by injecting a molten resin inside the shaping die and cooling-solidifying the molten resin. COPYRIGHT: (C)2010,JPO&INPIT