PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a printed circuit board having a high electromagnetic shielding performance, and a manufacturing method thereof. SOLUTION: Signal wires 12 are disposed on one principal surface of a first inter-layer insulator layer 11, and a first ground layer 13 is extended over th...

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Bibliographic Details
Main Author HOSOKAWA SHIN
Format Patent
LanguageEnglish
Published 08.04.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a printed circuit board having a high electromagnetic shielding performance, and a manufacturing method thereof. SOLUTION: Signal wires 12 are disposed on one principal surface of a first inter-layer insulator layer 11, and a first ground layer 13 is extended over the other principal surface. A second ground layer 15 is extended over one principal surface of a second inter-layer insulator layer 14, and the other principal surface is stuck to the one principal surface of the first inter-layer insulator layer 11 via a first adhesive 16. Trenches 17 piercing the second ground layer 15 from the first ground layer 13 are provided in parallel along both sides of each signal wire 12, and a conductor layer 18 which is stuck to surfaces of trenches 17 and is electrically connected to the first ground layer 13 and the second ground layer 15 is formed. A second adhesive 19 filling the trenches 17 is formed, and a first cover layer 20 and a second cover layer 21 are stuck via the second adhesive 19. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080248128